Organic silicon thermal conductive gel
The two-component 1:1 mixed silicone thermal conductive gel is mainly used in communication, electronics, instruments, servers, automotive electronic parts, avionics, consumer electronics, high power microprocessors, power modules, etc.
Product features
It can be cured at room temperature or heated to form a low hardness elastic body that can be calendered, with the characteristic of faster curing at higher temperatures. During the curing reaction, there are no by-products, low shrinkage, no corrosion, no precipitation of low molecular weight silicone oil, automatic dispensing, and low installation stress. After solidification, the chemical properties are stable and there is no powdering phenomenon, which can reliably dissipate heat for power electronic devices.
| Physical property items | Unit | Test method |
ZJ-DR 6200-1 |
ZJ-DR 6200-2 |
ZJ-DR 6200-3 |
ZJ-DR 6200-4 |
ZJ-DR 6200-5 |
ZJ-DR 6200-6 |
| Before curing | ||||||||
|
Viscosity（mpa.s） |
A |
GB/T 2794 |
10500 |
90000 |
110000 |
194800 |
200000 |
220000 |
|
B |
GB/T 2794 |
26000 |
120000 |
130000 |
180000 |
220000 |
230000 |
|
|
Density(g/cm3) |
A |
GB/T 13354 |
1.8 |
2.1 |
3.0 |
3.3 |
3.4 |
3.4 |
|
B |
GB/T 13354 |
1.8 |
2.1 |
3.0 |
3.3 |
3.4 |
3.4 |
|
|
Mixed density(g/cm3) |
A+B |
GB/T 13354 |
1.8 |
2.1 |
3.0 |
3.3 |
3.4 |
3.4 |
|
Operable time/23℃(h) |
A+B |
GB/T 7123 |
1 |
1 |
1 |
1 |
1 |
1 |
|
Gel time/23℃(h) |
A+B |
/ |
6 |
6 |
6 |
6 |
6 |
6 |
|
Curing conditions(℃×min) |
A+B |
/ |
120×30 |
120×30 |
120×30 |
120×30 |
120×30 |
120×30 |
| After curing | ||||||||
|
Density/23℃(g/cm3) |
GB/T 13354 |
1.8 |
2.05 |
3.0 |
3.3 |
3.4 |
3.4 |
|
|
shore(00) |
/ |
45 |
45 |
50 |
50 |
55 |
65 |
|
|
Volume resistivity(Ω·cm) |
GB/T 1692 |
1014 |
1013 |
1013 |
1011 |
1013 |
1013 |
|
|
Dielectric strength（KV/mm） |
GB/T 1695 |
14 |
13 |
13 |
13 |
13 |
13 |
|
| Flame retardancy |
/ |
V0 |
V0 |
V0 |
V0 |
V0 |
V0 |
|
|
Thermal conductivity(W/ m.k) |
TCI-2-A |
1.0 |
2.0 |
3.0 |
4.0 |
5.0 |
6.0 |
|
- Before use, components A and B should be thoroughly stirred separately, and then components A and B should be thoroughly mixed evenly in a 1:1 mass ratio. Stir for 5 minutes and apply glue within 40 minutes.
- It is recommended that after applying the thermal conductive gel, it should be de foamed under the vacuum of -0.09MPa~-0.08MPa for 5-10 minutes, then it should be left to level for 20 minutes before being heated and cured.
- Temperature and curing time: 23 ℃, after mixing A and B, the surface begins to dry at 2.0 hours; When the temperature is lower than 23 ℃, the gel time becomes longer; Above 23 ℃, with a surface drying time of less than 2.0 hours; Fully cure at 120 ℃ for 30 minutes.
- The mixed adhesive should be sealed, stored, and used up within a safe operating period, otherwise it will slowly solidify and cause waste.
- This product is not a hazardous material, but do not enter or eye contact. If accidentally splashed, rinse with plenty of water.
- Do not contact with N, P, S, plasma compounds such as sulfur, polysulfide, polysulfone or other sulfur containing materials, amine, polyurethane, amide and azide, organotin compounds and silicone rubber containing organotin catalysts to avoid poisoning the platinum catalyst poisoning and curing failure.
Pack a set of 20Kg components A and 20Kg components B (small barrels), or a set of 200Kg components A and 200Kg components B (large barrels).
Store in a dry place for a storage period of 6 months (at 25 ℃). If it expires, it needs to be retested and can be used again after passing the inspection. This type of product belongs to non hazardous goods and can be transported as general chemicals. The A and B components of the colloid must be sealed and stored to prevent leakage during transportation!